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Flux used before the post -flux for smearing freshly etched copper conductive pattern in order to prevent its oxidation. If it is used after post- flux, the replacement of the flux must be ensured. For optimal coverage by the flux, it should have high viscosity where the molecular weight and the softening point of the contained rosin as well as the activators play a major role. This property is known as (flux cover ability). See also Post-flux.