| Flux | Flux classification | Particular advantage |
| NH (LVA) 100% halide-free |
ROL0 | reduces voids, improves printability |
| MR-NH | ROL0 | even appropriate for applications with an area ratio smaller than 0.6 |
| NH(-MDL) 100% halide-free |
ROL0 | micro dispensing |
| NH (IMT) 100% halide-free |
ROL0 | characteristics like L1 paste, still perfect after long open time |
| NH-JLB | ROL0 | also for bismuth solders for jet printing |
| G40 N2 recommended |
ROL0 | acryl based viscoelastic flux |
| G40 A N2 recommended |
ROL1 | acryl based viscoelastic flux |
| SNTP | ROL1 | solder paste for package-on-package (POP) |
| FS for powder size (N) |
ROL1 | super fine pitch component size 01005 |
| SPT for powder size (G) |
ROL1 | solder paste powder size 6 |
| INP | ROL1 | designed for indium based alloys |
| MHS-32 | ROL1 | designed for tinn-zinc alloys |
| GT-Serie | ROL1 | high preheat resistance, perfect print shape |
| SUC-Serie | ROL1 | O2 Reflow, wenig Lunker / O2 reflow low voiding |
| PZV | ROL1 | perfect for low peak-temperatures |
| H-FA | ROL0 | laser applications |
| MDA-5 | ROL1 | jet printing paste for MYDATA U |
| MJD | ROL1 | jet printing paste for Musashi R5-20 |
| SSI-M | ROM1 | laser application |
| TM-HP (O) | ROM1 | long open time |
| SBR | ROL1 | ideal for bismuth alloys |
| Alloy | Composition | Melting range | Particular advantage |
| LFM-65 | Sn-58.0Bi | 139°C | very low melting range, Sn-Bi eutectic |
| LFM-89 | Sn-57.6Bi-0.4Ag | 139–168°C | very low melting bismuth alloys with increased strength |
| LFM-78 | Sn-57.0Bi-1.0Ag | 139–179°C | very low melting bismuth alloys with increased strength |
| LFM-31 | Sn-8.0Zn-3.0Bi | 190–203°C | also usable with temperature profile of Sn-Pb alloys |
| LFM-70 | Sn-3.5Ag-0.5Bi-8.0In | 194– 206°C | low melting range, SABI |
| LFM-96 | Sn-3.5Ag-0.5Bi-6.0In | 202–210°C | low melting range, SABI |
| SJM-03 | Sn-0.3Ag-0.7Cu-2.0Bi-α | 210–225°C | low Ag, high solder joint strength |
| LFM-90 | Sn-1.0Ag-0.7Cu | 217–224°C | JEITA recommended |
| SJM-35 | Sn-3.5Ag-2.0Bi | 216–220°C | high Ag, high solder joint strength |
| SJM-30 | Sn-3.0Ag-2.0Bi-1.0Sb | 216–224°C | high solder joint strength |
| LFM-48 | Sn-3.0Ag-0.5Cu | 217–220°C | SAC, JEITA recommended |
| LFM-73 | Sn-1.0Ag-0.5Cu | 217–226°C | low Ag, SAC |
| LFM-86 | Sn-0.3Ag-0.7Cu | 217–228°C | low Ag, SAC |
| LFM-34 | Sn-3.5Ag eutectic | 221°C | Sn-Ag |
| SJM-40* | Sn-4.0Ag-2.0Bi-3.0Sb-α | 221–227°C | high Ag, very high solder joint strength |
| LFM-57 | Sn-5.0Sb | 235–240°C | high melting range |
| LFM-74 | Sn-10.0Sb | 246–258°C | high melting range, Sn-Sb |
Powder size: X, W, U, N
All our lead-free solder pastes are available with the following flux content: 11-14%
*SJM-40 is patented under: JP PAT Nr. 3045453
SJM = Strong Joint Metal
LFM = Leadfree Metal
| Alloy | Flux classification | Laser & inductive soldering | Reflow soldering (SMT) |
| LFM-48 (SAC 305) |
L0 | HF-A | MR-NH |
| L1 | - | GT-Series | |
| M1 | SSI-M | TM-HP(O) | |
| SJM-Series (Sn, Ag, Cu, Bi) |
L0 | HF-A | NH(IMT) |
| L1 | - | GT-Series | |
| M1 | SSI-M | TM-HP(O) | |
| LFM-96 | L1 | - | INP |
Almit GmbH
Unterer Hammer 3
DE 64720 Michelstadt,
Germany.
:+49 (0) 6061 96925 0
:+49 (0) 6061 96925 18
:info@almit.de
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