Almit Solder Paste Lead Free Flux & Alloy Classifications

Solder Paste Lead Free Flux & Alloy

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Flux	Solders	Flux classification	Particular advantage
NH 100% halogenfrei	Sn, Ag, Cu	RO L0	halide-free production
NH (E) 100% halogenfrei	Sn, Ag, Cu	RO L0	halide-free, minimizes solder ball
NH (EB) 100% halogenfrei	Sn, Ag, Cu, Bi, Fe	RO L0	halide-free, reduces voiding substantially
NH (K) 100% halogenfrei	Sn, Ag, Cu	RO L0	halide-free, oxidized components
NH (LS) 100% halogenfrei	Sn, Ag, Cu	RO L0	halidefree, laser application
NH (M) 100% halogenfrei	Sn, Ag, Cu	RO L0	halide-free, paper-phenol boards
NH (IMT) 100% halogenfrei	Sn, Ag, Cu, Bi	RO L0	Characteristics like L1 paste, still perfect after long open time
SUC-FS	Sn, Ag, Cu	RO L0	low melting range
TM-HP-S 100% halogenfrei	Sn, Ag, Cu	RO L0	high-speed printing
A-75 C (L)	Sn, Bi	RO L1	special low melting point, eutectic
FS	Sn, Ag, Cu	RO L1	component size 01005
GT	Sn, Ag, Cu	RO L1	high preheat resistance
GT (R)	Sn, Ag, Bi, Sb	RO L1	high preheat resistance, perfect print shape
IBL	Sn, Ag, Bi, In	RO L1	low melting range
INP	Sn, Ag, Bi, In	RO L1	high preheat resistance
MHS-32	SN, ZN, Bi, Sb	RO L1	high preheat resistance, perfect print shape
PMK	Sn, Ag, Cu	RO L1	less fux spitting
SSI-M	Sn, Ag, Cu	RO L1	laser application
SUC-Series	Sn, Ag, Bi, Sb, Cu	RO L1	0₂ low voiding
TM-HP	Sn, Ag, Cu	RO L1	high preheat resistance, perfect print shape
TM-HP (L)	Sn, Ag, Cu	RO L1	long stencil life
TM-HP-P	Sn, Ag, Cu	RO L1	difficult wettable surfaces

Alloy	Composition	Melting range	Particular advantage
SJM-03	Sn-0.3Ag-0.7Cu-2.0Bi-α	210–226°C	low Ag, high solder joint strength
SJM-10	Sn-1.0Ag-0.7Cu-2.0Bi-α	212–224°C	low Ag, high solder joint strength
SJM-30	Sn-3.0Ag-2.0Bi-1.0Sb	216–224°C	high solder joint strength
SJM-35	Sn-3.5Ag-2.0Bi	216–220°C	high Ag, high solder joint strength
SJM-40^*	Sn-4.0Ag-2.0Bi-3.0Sb-α	221– 27°C	high Ag, very high solder joint strength
LFM-14	Sn-3.5Ag-0.7Cu	217–218°C	SAC
LFM-31	Sn-8.0Zn-3.0Bi	190–203°C	Sn-Zn
LFM-34	Sn-3.5Ag	221°C	Sn-Ag Eutectic
LFM-48	Sn-3.0Ag-0.5Cu	217–221°C	SAC, JEITA recommended
LFM-65	Sn-58.0Bi	139°C	very low melting range, Sn-Bi Eutectic
LFM-70	Sn-3.5Ag-0.5Bi-8.0In	194–206°C	low melting range, SABI
LFM-73	Sn-1.0Ag-0.5Cu	217–226°C	low Ag, SAC
LFM-74	Sn-10.0Sb	246–258°C	high melting range, Sn-Sb
LFM-82	Sn-3.9Ag-0.7Cu	217–218°C	SAC
LFM-86	Sn-0.3Ag-0.7Cu	217–228°C	low Ag, SAC
LFM-94	Sn-1.0Ag-0.7Cu-2.0Bi	211–221°C	JEITA recommended

^*SJM-40 is patented under: JP PAT Nr. 3045453