Flux of lead-free solder pastes
| Flux |
Flux classification |
Particular advantage |
NH (LVA)
100% halide-free |
ROL0 |
reduces voids, improves printability |
| MR-NH |
ROL0 |
even appropriate for applications with an area ratio smaller than 0.6 |
NH(-MDL)
100% halide-free |
ROL0 |
micro dispensing |
NH (IMT)
100% halide-free |
ROL0 |
characteristics like L1 paste, still perfect after long open time |
| INP |
ROL1 |
designed for indium based alloys |
| GT-Serie |
ROL1 |
high preheat resistance, perfect print shape |
| SUC-Serie |
ROL1 |
O2-reflow, low voiding |
| PZV |
ROL1 |
perfect for low peak temperatures |
| HF-A |
ROL0 |
laser applications |
| MDA-5 |
ROL1 |
jet printing paste for MYDATA U |
| MJD |
ROL1 |
jet printing paste for Musashi R5-20 |
| SSI-M |
ROM1 |
laser application |
| TM-HP (O) |
ROM1 |
long open time |
| SBR |
ROL1 |
ideal for bismuth alloys |
Lead-free solder paste alloys at a glance
| Alloy |
Composition |
Melting range |
Particular advantage |
| LFM-65 |
Sn-58.0Bi |
139°C |
very low melting range, Sn-Bi eutectic |
| LFM-89 |
Sn-57.6Bi-0.4Ag |
139–168°C |
very low melting bismuth alloys with increased strength |
| LFM-78 |
Sn-57.0Bi-1.0Ag |
139–179°C |
very low melting bismuth alloys with increased strength |
| LFM-31 |
Sn-8.0Zn-3.0Bi |
190–203°C |
also usable with temperature profile of Sn-Pb alloys |
| LFM-70 |
Sn-3.5Ag-0.5Bi-8.0In |
194– 206°C |
low melting range, SABI |
| LFM-96 |
Sn-3.5Ag-0.5Bi-6.0In |
202–210°C |
low melting range, SABI |
| SJM-03 |
Sn-0.3Ag-0.7Cu-2.0Bi-α |
210–225°C |
low Ag, high solder joint strength |
| LFM-90 |
Sn-1.0Ag-0.7Cu |
217–224°C |
JEITA recommended |
| LFM-48 |
Sn-3.0Ag-0.5Cu |
217–220°C |
SAC, JEITA recommended |
| LFM-86 |
Sn-0.3Ag-0.7Cu |
217–228°C |
low Ag, SAC |
| LFM-34 |
Sn-3.5Ag eutectic |
221°C |
Sn-Ag |
| SJM-40* |
Sn-4.0Ag-2.0Bi-3.0Sb-α |
221–227°C |
high Ag, very high solder joint strength |
| LFM-57 |
Sn-5.0Sb |
235–240°C |
high melting range |
| LFM-74 |
Sn-10.0Sb |
246–258°C |
high melting range, Sn-Sb |
Powder size: X, W, U, N
All our lead-free solder pastes are available with the following flux content: 11-14%
*SJM-40 is patented under: JP PAT Nr. 3045453
SJM = Strong Joint Metal
LFM = Leadfree Metal
Favored product combinations for Almit solder pastes
| Alloy |
Flux classification |
Laser & inductive soldering |
Reflow soldering (SMT) |
LFM-48
(SAC 305) |
L0 |
HF-A
NH-MDL |
MR-NH |
| L1 |
SSI-M |
GT-Series |
| M1 |
- |
TM-HP(O) |
SJM-Series
(Sn, Ag, Cu, Bi) |
L0 |
- |
NH(IMT) |
| L1 |
- |
GT-Series |
| M1 |
- |
TM-HP(O) |
| LFM-96 |
L1 |
- |
INP |
Crain size (µm) according to IPC
| powder size |
10% max. less than |
80% min. between |
10% max. between |
less than 0,5% larger than |
| 3 |
25 |
25 - 45 |
45 - 60 |
60 |
| 4 |
20 |
20 - 38 |
38 - 50 |
50 |
| 5 |
15 |
15 - 25 |
25 - 40 |
40 |
| 6 |
5 |
5 - 15 |
15 |
25 |
| 7 |
2 |
2 - 11 |
11 |
15 |
Almit powder sizes according to J-STD 005
| Almit name |
X |
W |
U |
N |
R |
G |
| Crain size in μm |
25-45 |
20-38 |
10-28 |
10-24 |
5-20 |
5-15 |
| Powder size |
3 |
4 |
5 |
5/6 |
5.5 |
6 |
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