Flux | Flux classification | Particular advantage |
NH (LVA) 100% halide-free |
ROL0 | reduces voids, improves printability |
MR-NH | ROL0 | even appropriate for applications with an area ratio smaller than 0.6 |
NH(-MDL) 100% halide-free |
ROL0 | micro dispensing |
NH (IMT) 100% halide-free |
ROL0 | characteristics like L1 paste, still perfect after long open time |
NH-JLB | ROL0 | also for bismuth solders for jet printing |
G40 N2 recommended |
ROL0 | acryl based viscoelastic flux |
G40 A N2 recommended |
ROL1 | acryl based viscoelastic flux |
SNTP | ROL1 | solder paste for package-on-package (POP) |
FS for powder size (N) |
ROL1 | super fine pitch component size 01005 |
SPT for powder size (G) |
ROL1 | solder paste powder size 6 |
INP | ROL1 | designed for indium based alloys |
MHS-32 | ROL1 | designed for tinn-zinc alloys |
GT-Serie | ROL1 | high preheat resistance, perfect print shape |
SUC-Serie | ROL1 | O2 Reflow, wenig Lunker / O2 reflow low voiding |
PZV | ROL1 | perfect for low peak-temperatures |
H-FA | ROL0 | laser applications |
MDA-5 | ROL1 | jet printing paste for MYDATA U |
MJD | ROL1 | jet printing paste for Musashi R5-20 |
SSI-M | ROM1 | laser application |
TM-HP (O) | ROM1 | long open time |
SBR | ROL1 | ideal for bismuth alloys |
Alloy | Composition | Melting range | Particular advantage |
LFM-65 | Sn-58.0Bi | 139°C | very low melting range, Sn-Bi eutectic |
LFM-89 | Sn-57.6Bi-0.4Ag | 139–168°C | very low melting bismuth alloys with increased strength |
LFM-78 | Sn-57.0Bi-1.0Ag | 139–179°C | very low melting bismuth alloys with increased strength |
LFM-31 | Sn-8.0Zn-3.0Bi | 190–203°C | also usable with temperature profile of Sn-Pb alloys |
LFM-70 | Sn-3.5Ag-0.5Bi-8.0In | 194– 206°C | low melting range, SABI |
LFM-96 | Sn-3.5Ag-0.5Bi-6.0In | 202–210°C | low melting range, SABI |
SJM-03 | Sn-0.3Ag-0.7Cu-2.0Bi-α | 210–225°C | low Ag, high solder joint strength |
LFM-90 | Sn-1.0Ag-0.7Cu | 217–224°C | JEITA recommended |
SJM-35 | Sn-3.5Ag-2.0Bi | 216–220°C | high Ag, high solder joint strength |
SJM-30 | Sn-3.0Ag-2.0Bi-1.0Sb | 216–224°C | high solder joint strength |
LFM-48 | Sn-3.0Ag-0.5Cu | 217–220°C | SAC, JEITA recommended |
LFM-73 | Sn-1.0Ag-0.5Cu | 217–226°C | low Ag, SAC |
LFM-86 | Sn-0.3Ag-0.7Cu | 217–228°C | low Ag, SAC |
LFM-34 | Sn-3.5Ag eutectic | 221°C | Sn-Ag |
SJM-40* | Sn-4.0Ag-2.0Bi-3.0Sb-α | 221–227°C | high Ag, very high solder joint strength |
LFM-57 | Sn-5.0Sb | 235–240°C | high melting range |
LFM-74 | Sn-10.0Sb | 246–258°C | high melting range, Sn-Sb |
Powder size: X, W, U, N
All our lead-free solder pastes are available with the following flux content: 11-14%
*SJM-40 is patented under: JP PAT Nr. 3045453
SJM = Strong Joint Metal
LFM = Leadfree Metal
Alloy | Flux classification | Laser & inductive soldering | Reflow soldering (SMT) |
LFM-48 (SAC 305) |
L0 | HF-A | MR-NH |
L1 | - | GT-Series | |
M1 | SSI-M | TM-HP(O) | |
SJM-Series (Sn, Ag, Cu, Bi) |
L0 | HF-A | NH(IMT) |
L1 | - | GT-Series | |
M1 | SSI-M | TM-HP(O) | |
LFM-96 | L1 | - | INP |