Solder Paste Lead Free Flux & Alloy

Flux of lead-free Solder Pastes

Flux Solders Flux classification Particular advantage
NH
100% halogenfrei
Sn, Ag, Cu RO L0 halide-free production
NH (E)
100% halogenfrei
Sn, Ag, Cu RO L0 halide-free, minimizes solder ball
NH (EB)
100% halogenfrei
Sn, Ag, Cu, Bi, Fe RO L0 halide-free, reduces voiding substantially
NH (K)
100% halogenfrei
Sn, Ag, Cu RO L0 halide-free, oxidized components
NH (LS)
100% halogenfrei
Sn, Ag, Cu RO L0 halidefree, laser application
NH (M)
100% halogenfrei
Sn, Ag, Cu RO L0 halide-free, paper-phenol boards
NH (IMT)
100% halogenfrei
Sn, Ag, Cu, Bi RO L0 Characteristics like L1 paste, still perfect after long open time
SUC-FS Sn, Ag, Cu RO L0 low melting range
TM-HP-S
100% halogenfrei
Sn, Ag, Cu RO L0 high-speed printing
A-75 C (L) Sn, Bi RO L1 special low melting point, eutectic
FS Sn, Ag, Cu RO L1 component size 01005
GT Sn, Ag, Cu RO L1 high preheat resistance
GT (R) Sn, Ag, Bi, Sb RO L1 high preheat resistance, perfect print shape
IBL Sn, Ag, Bi, In RO L1 low melting range
INP Sn, Ag, Bi, In RO L1 high preheat resistance
MHS-32 SN, ZN, Bi, Sb RO L1 high preheat resistance, perfect print shape
PMK Sn, Ag, Cu RO L1 less fux spitting
SSI-M Sn, Ag, Cu RO L1 laser application
SUC-Series Sn, Ag, Bi, Sb, Cu RO L1 02 low voiding
TM-HP Sn, Ag, Cu RO L1 high preheat resistance, perfect print shape
TM-HP (L) Sn, Ag, Cu RO L1 long stencil life
TM-HP-P Sn, Ag, Cu RO L1 difficult wettable surfaces

Lead-free Solder Paste Alloys at a Glance

Alloy Composition Melting range Particular advantage
SJM-03 Sn-0.3Ag-0.7Cu-2.0Bi-α 210–226°C low Ag, high solder joint strength
SJM-10 Sn-1.0Ag-0.7Cu-2.0Bi-α 212–224°C low Ag, high solder joint strength
SJM-30 Sn-3.0Ag-2.0Bi-1.0Sb 216–224°C high solder joint strength
SJM-35 Sn-3.5Ag-2.0Bi 216–220°C high Ag, high solder joint strength
SJM-40* Sn-4.0Ag-2.0Bi-3.0Sb-α 221– 27°C high Ag, very high solder joint strength
LFM-14 Sn-3.5Ag-0.7Cu 217–218°C SAC
LFM-31 Sn-8.0Zn-3.0Bi 190–203°C Sn-Zn
LFM-34 Sn-3.5Ag 221°C Sn-Ag Eutectic
LFM-48 Sn-3.0Ag-0.5Cu 217–221°C SAC, JEITA recommended
LFM-65 Sn-58.0Bi 139°C very low melting range, Sn-Bi Eutectic
LFM-70 Sn-3.5Ag-0.5Bi-8.0In 194–206°C low melting range, SABI
LFM-73 Sn-1.0Ag-0.5Cu 217–226°C low Ag, SAC
LFM-74 Sn-10.0Sb 246–258°C high melting range, Sn-Sb
LFM-82 Sn-3.9Ag-0.7Cu 217–218°C SAC
LFM-86 Sn-0.3Ag-0.7Cu 217–228°C low Ag, SAC
LFM-94 Sn-1.0Ag-0.7Cu-2.0Bi 211–221°C JEITA recommended

*SJM-40 is patented under: JP PAT Nr. 3045453