Solder Paste Lead Free Flux & Alloy

Flux of lead-free Solder Pastes

Flux Flux classification Particular advantage
NH (LVA)
100% halide-free
ROL0 reduces voids, improves printability
MR-NH ROL0 even appropriate for applications with an area ratio smaller than 0.6
NH(-MDL)
100% halide-free
ROL0 micro dispensing
NH (IMT)
100% halide-free
ROL0 characteristics like L1 paste, still perfect after long open time
NH-JLB ROL0 also for bismuth solders for jet printing
G40
N2 recommended
ROL0 acryl based viscoelastic flux
G40 A
N2 recommended
ROL1 acryl based viscoelastic flux
SNTP ROL1 solder paste for package-on-package (POP)
FS
for powder size (N)
ROL1 super fine pitch component size 01005
SPT
for powder size (G)
ROL1 solder paste powder size 6
INP ROL1 designed for indium based alloys
MHS-32 ROL1 designed for tinn-zinc alloys
GT-Serie ROL1 high preheat resistance, perfect print shape
SUC-Serie ROL1 O2 Reflow, wenig Lunker / O2 reflow low voiding
PZV ROL1 perfect for low peak-temperatures
H-FA ROL0 laser applications
MDA-5 ROL1 jet printing paste for MYDATA U
MJD ROL1 jet printing paste for Musashi R5-20
SSI-M ROM1 laser application
TM-HP (O) ROM1 long open time
SBR ROL1 ideal for bismuth alloys

Lead-free Solder Paste Alloys at a Glance

Alloy Composition Melting range Particular advantage
LFM-65 Sn-58.0Bi 139°C very low melting range, Sn-Bi eutectic
LFM-89 Sn-57.6Bi-0.4Ag 139–168°C very low melting bismuth alloys with increased strength
LFM-78 Sn-57.0Bi-1.0Ag 139–179°C very low melting bismuth alloys with increased strength
LFM-31 Sn-8.0Zn-3.0Bi 190–203°C also usable with temperature profile of Sn-Pb alloys
LFM-70 Sn-3.5Ag-0.5Bi-8.0In 194– 206°C low melting range, SABI
LFM-96 Sn-3.5Ag-0.5Bi-6.0In 202–210°C low melting range, SABI
SJM-03 Sn-0.3Ag-0.7Cu-2.0Bi-α 210–225°C low Ag, high solder joint strength
LFM-90 Sn-1.0Ag-0.7Cu 217–224°C JEITA recommended
SJM-35 Sn-3.5Ag-2.0Bi 216–220°C high Ag, high solder joint strength
SJM-30 Sn-3.0Ag-2.0Bi-1.0Sb 216–224°C high solder joint strength
LFM-48 Sn-3.0Ag-0.5Cu 217–220°C SAC, JEITA recommended
LFM-73 Sn-1.0Ag-0.5Cu 217–226°C low Ag, SAC
LFM-86 Sn-0.3Ag-0.7Cu 217–228°C low Ag, SAC
LFM-34 Sn-3.5Ag eutectic 221°C Sn-Ag
SJM-40* Sn-4.0Ag-2.0Bi-3.0Sb-α 221–227°C high Ag, very high solder joint strength
LFM-57 Sn-5.0Sb 235–240°C high melting range
LFM-74 Sn-10.0Sb 246–258°C high melting range, Sn-Sb

Powder size: X, W, U, N
All our lead-free solder pastes are available with the following flux content: 11-14%
*SJM-40 is patented under: JP PAT Nr. 3045453
SJM = Strong Joint Metal
LFM = Leadfree Metal

Favored product combinations for Almit solder pastes

Alloy Flux classification Laser & inductive soldering Reflow soldering (SMT)
LFM-48
(SAC 305)
L0 HF-A MR-NH
L1 - GT-Series
M1 SSI-M TM-HP(O)
SJM-Series
(Sn, Ag, Cu, Bi)
L0 HF-A NH(IMT)
L1 - GT-Series
M1 SSI-M TM-HP(O)
LFM-96 L1 - INP