Perfect performance for the SMT-process

    Do you think that soldering defects cannot be prevented in the SMT-process? This is just not true. Discover the GT solder paste. It guarantees optimum wetting on the most widely varied surface materials and keep high yield by minimising soldering defects.

    Short facts:

    almit_a Amongst other materials suitable for copper, nickel, brass and phosphor-bronze
    almit_a RoHS compliant

    Special advantages

    almit_a Optimum wetting
    almit_a Very wide range of applications
    almit_a Designed for PIP/THR
    almit_a Very good printing even on the smallest structures

    This advantage can be seen in the following videos:

    This video proves the high quality of our GT soldering paste. The paste is all gathered and there is no remaining solder powder at all.

     

    This video shows the outstanding wetting performance while 0.15mm off set print of out GT solder paste (especially with low-silver alloy).

    Another good example of the outstanding quality of your GT soldering paste is the comparison to a compatible paste of a competitor. The following videos show our GT soldering paste while printing in THR application. In comparison to the competitors paste, our GT-soldering paste can even be used without Pre-Forms:

     

    Almit GT-soldering paste

    almit_a No dripping solder balls during pre heat
    almit_a GT soldering paste wets up very quickly

    Competitors paste

    almit_a Heavy dripping paste during pre heat
    almit_a Compeitors paste not wetting up at all