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    Almit products

    GUMMIX-Serie

    Top sellers for good reasons
    No detaching, no cracking and only minimal flux splashes - our GUMMIX series is second to none.

    Due to their almost completely splash-free behaviour, the solder wires of the GUMMIX series are particularly suitable for contactless soldering applications, such as laser, induction, wave soldering and xenon lamp, but also for robot soldering and piston soldering.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a lead-free and leaded Gummix solder wires available
    almit_a RoHS compliant

    Minimal flux splashes
    almit_a Minimum quantity of flux splattering
    almit_a No detachment of the flux residues
    almit_a No crack formation
    almit_a Suitable for flexible boards

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    LFM-23 S

    5x longer soldering tip holding time

    The high-performance alloy without silver - LFM-23 S convinces with the best properties of a SnCuNi alloy. High quality, reliable and cost-effective. With a decisive plus: An innovative iron/gallium compound in LFM-23 S reduces oxidation and minimizes iron erosion on the soldering tip. The soldering tip life is increased up to five times and thus helps to reduce production costs.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a Without silver
    almit_a With innovative iron/gallium compound
    almit_a RoHS compliant

    Special advantages
    almit_a 5x higher soldering tip life
    almit_a Little flux splashes
    almit_a High material strength

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    MR-NH

    small area ratio, big performance
    The constantly increasing miniaturization poses completely new challenges for industrial production. In order to meet these at eye level, we are developing new generations of soldering and fluxing agents in our Almit research centres. MR-NH is an innovative high-performance solder paste with an outstanding performance that opens up new dimensions in SMT production and stencil printing. Even in applications with an area ratio of less than 0.6, MR-NH convinces with perfect release properties, so that a step stencil is not required for a high component mix.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a Area ratio < 0.6
    almit_a Powder size 20-38 µm
    almit_a ROL0 halogen-free

    Special advantages
    almit_a Excellent print image
    almit_a Excellent release properties
    almit_a Optimal contour stability
    almit_a Applicable with almost all stencils

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    SJM Series

    Long-term reliability in any form
    The solder wires and solder pastes of the SJM series are the result of extensive development work by Almit research. The SJM series sets new standards in the strength of lead-free solder wire, which previously could only be achieved by using leaded solder wire. With five different alloys with different filler metals, there is a suitable solder wire or solder paste for every specific application.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a SJM = Strong Joint Metal (alloys with particularly high strength)
    almit_a Individual composition for every requirement

    Special advantages
    almit_a No Cracking
    almit_a Perfect strength
    almit_a from 0.3% to 4% silver content
    almit_a patented alloy
    almit_a ideal for through-hole plating

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    S line + M line

    The life insurance for soldering tips
    There is no remedy against the erosion of the soldering tip anyway, that's what it was thought until now. It's time to rethink. The patented S-Line has successfully proven that the use of the correct alloy can greatly minimize soldering tip erosion and thus significantly extend the life of a soldering tip. What is true for the S-line and erosion is even more true for the new M-line in terms of oxidation. This is because the new M-Line can not only reduce oxidation, but almost completely prevent it.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a S-Line: Minimization of solder tip erosion
    almit_a M-line: Reduction of oxidation
    almit_a Individual composition for every requirement

    Special advantages
    The S line allows for minimizing erosion, the M line prevents oxidation.
    The result:
    almit_a Reduced soldering tip consumption
    almit_a Reduced soldering time and labour costs
    almit_a Reduced solder consumption = enormous cost saving

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    GT-Flux Solder Paste

    Perfect performance for the SMT-process
    Do you think that soldering defects cannot be prevented in the SMT-process? This is just not true. Discover the GT solder paste. It guarantees optimum wetting on the most widely varied surface materials and keep high yield by minimising soldering defects.

    Do you wish for an individual consultation? We are looking forward to hearing from you at technicalsupport@almit.de.

    Short facts:
    almit_a Amongst other materials suitable for copper, nickel, brass and phosphor-bronze
    almit_a RoHS compliant

    Special advantages
    almit_a Optimum wetting
    almit_a Very wide range of applications
    almit_a Designed for PIP/THR
    almit_a Very good printing even on the smallest structures

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    Good to know

    Compendium

    352 pages covering the latest information on industrial and manual soldering. Discover the must-have for soldering experts!

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    Almit GmbH
    Unterer Hammer 3
    DE 64720 Michelstadt

     

    phone   +49 (0) 6061 96925 0
    phone   +49 (0) 6061 96925 18
    phone   info@almit.de