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    • Technology 
      • Top Sellers
        • Contactless soldering
        • Silver free alloy
        • Small area-ratio solder paste
        • Increased solder joint strength
        • Soldering tip-protecting alloy
        • Allrounder solder paste
        • Halogen-free with L1 quality
        • Dual boost for wetting
        • HALOGEN-FREE DUAL BOOST
        • Protection against copper leaching
      • Know-How
        • Compendium
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        • Expertise
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      • Almit Classifications
        • Solder wire lead free Flux & Alloy
        • Solder paste lead free Flux & Alloy
        • Solder wire leaded flux
        • Solder paste leaded
        • Solder bars and wires
        • Flux
      • Alloy Overview
      • Alloy Surcharge
      • PIEK and IPC-Training
      • Important notice
    • Shop
    • Solder wire 
        • Solder wire lead free
        • » LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
          •  DB-ZERO LFM-48M
          •  SRS-ZL LFM-48 S (3.5%)
          •  GUMMIX-19 NH LFM-48-S (3.5%)
          •  DB-1 RMA LFM-48M (3.5%)
          •  SR-38 RMA LFM-48 S (3.50%)
          •  GUMMIX-21 Zeta LFM-48-M (3,50%)
          •  BT-19 LFM-48 S (3.50%)
          •  QB-1 LFM-48 M 3.5%
          •  SR-LA Super LFM-48-M (3,50%)
          •  SR-37 LFM-48 S (4.50%)
          •  SR-37 LFM-48 S (3.50%)
          •  SR-37 LFM-48 S (2.50%)
          •  SR-55 LFM-48 S
        • » LFM-22 S (Sn-0.7Cu+α) 228°C
          •  SR-37 LFM-22 S (3.50%)
        • » LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
          •  SRS-ZL LFM-23 S (3.5%)
          •  DB1-RMA LFM-23S 3,5% Flux 3,5%
          •  QB-1 LFM-23S 3.5%
          •  SR-LA SUPER LFM 23-S (3.50%)
          •  SR-LA SUPER LFM 23-S (2.5%)
        • » LFM-41 S (Sn-0.3Ag-2.0Cu+α) 217-271°C
          •  SR-37 LFM-41 S (3.50%)
        • » LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  Gummix HF LFM 48
          •  GUMMIX-19 NH LFM-48 (3.50%)
          •  GUMMIX-SB RMA LFM-48 (3.50%)
          •  KR-19 SH RMA LFM-48 (3.50%)
          •  SR-37 LFM-48 (3.50%)
          •  KR-19 LFM-48 (3.50%)
        • » SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
          •  SRS-RMA-NC SJM-03 S (3.50%)
          •  GUMMIX-21 Zeta SJM-03 S (3.50%)
          •  GUMMIX-21 Zeta SJM-03 S (2.50%)
          •  SR-LA SJM-03-S (3.50%)
        • Solder wire leaded
        • » Sn63 (Sn-37.0Pb)
          •  SRC HM1 RMA Sn63 (9.50%)
          •  KR-19 RMA Sn63 (2.20%)
        • » 60A (Sn-40Pb)
          •  KR-19 60A (2.20%)
          •  KR-19 SH RMA 60A (2.20%)
          •  GUMMIX-SB RMA 60A (2.20%)
        • » Sn62 (Sn-2.0Ag-36.0Pb)
          •  KR-19 SH RMA Sn62 (2.20%)
        • » Sn8 (Sn-92Pb)
          •  KR-28 Sn8 (2.20%)
        • GUMMIX Series
        • » LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
          •  GUMMIX-21 Zeta LFM 23-S (3.50%)
        • » LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  GUMMIX SB RMA LFM-48 (3.50%)
          •  Gummix HF LFM 48
          •  GUMMIX-19 NH LFM-48 (3.50%)
          •  GUMMIX-19 CH LFM-48 (3.50%)
        • » LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
          •  GUMMIX-21 Zeta LFM-48-M (3,50%)
          •  GUMMIX-19 NH LFM-48-S (3.5%)
        • » SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
          •  GUMMIX-21 Zeta SJM-03 S (3.50%)
        • Accessories
        • » Desoldering braid
        • » Tip cleaner
        • » Flux removers
        • Flux Classification
        flux_classification
    • Solder paste 
        • Solder paste lead free
        • » LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  LFM-48 MR-NH (for aspect ration < 0,6)
          •  LFM-48W NH-GE
          •  LFM-48W NH-GE
          •  LFM 48 NH(LVA) (LVA=Low Void Additive)
          •  LFM-48 NH IMT (optimized print volume)
          •  LFM-48 GT(R)-SR 12%
          •  LFM-48 FS (for powder size 5.5)
          •  LFM-48 TM-HP (O) (long open time)
        • » SJM-03 (Sn-0.3Ag-0.7Cu-2.0Bi) 210-226°C
          •  SJM-03 NH IMT (11.50%)
        • » SJM-40 (Sn-4.0Ag-2.0Bi-3.0Sb) 221-227°C
          •  SJM-40
          •  SJM-40W NH(IMT)
          •  SJM-40W GT(R)-SR 12%
        • » LFM-65 (Sn-58.0Bi) 139°C
          •  LFM-65W TM-HP(NC)
        • » LFM-89 (Sn-57.6Bi-0.4Ag) 139°-141°C
        • » LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
          •  LFM-70 INP (11%)
          •  LFM-70 INP (14%)
        • » LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 194-206°C
          •  LFM-96W INP (11%)
        • Solder paste leaded
        • » Sn62 (Sn-2.0Ag-36Pb)
          •  Sn62 SRC HM1 RMA (9.50%)
          •  Sn62 SRC HM1 RMA T3 (9.50%)
          •  Sn62 SRC HM1 RMA (12%)
          •  SRC Sn62U SS4M (15%) Mydata/Micronics Jet Paste
          •  SRC Sn62U SDL Flux 15% Jet Paste
        • » SJ7 (Sn-34.5Pb-3.0Ag-0.5Sb)
          •  SJ7 HA2-RA (10%)
        • Dispenser Paste
        • » LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  LFM-48U SDK(NH) 15%.Jet Paste
          •  LFM-48 NH-MDL for very high temperature gradient
          •  LFM-48W NH Dispensing paste
          •  LFM-48U MDA-5 (10-28µm) Jet Paste for Mydata/Mycronic
          •  LFM-48U SDK (10-28µm) Jet Paste
          •  LFM-48U MJD Jet Paste
          •  LFM 48 GT Dispensing Paste
          •  LFM-48 SSI-M for very high temperature gradient
        • » LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
          •  LFM 70 INP Dispenser Paste
        • » LFM-89 (Sn-58.0Bi-0.4Ag) 139°C-168°C
          •  LFM-89 NH-MDL Micro-Dispensing Lasersoldering
        • » Sn62 (Sn-2.0Ag-36Pb) 179-190°C
          •  SRC Sn62U SS4M (15%) Mydata/Mycronic Jet Paste
          •  SRC Sn62U SDL Flux 15% Jet Paste
          •  Sn62 SRC HM1 RMA (12%)
        • Accessories
        • » Solder paste spatula ESD safe
        • » Solder paste softener
        • Flux Classification
        flux_classification
    • Solder bars 
        • Solder bars and solid wire
        • » LFM-22 H (Sn-0.7Cu)
        • » LFM-48 H (Sn-3.0Ag-0.5Cu)
        • » LFM-59 H (Sn 3.0Cu)
        • » LFM-62 H (Sn-3,0Cu-0,5Ni)
    • Flux 
        • Flux
        • » BM-1 RMA
        • » BM-5000 RMA
        • » RC-15SH RMA
        • » RC-281 PF
    • Applications 
        • Laser soldering
        • » Solder wire
          •  GUMMIX SB RMA LFM-48 217-220°C
          •  GUMMIX-21 Zeta LFM 23-S (3.50%) 228°C
          •  Gummix HF LFM 48
        • » Solder Paste
          •  LFM-48 SSI-M (14%) 217-220°C
        • Flux Classification
        flux_classification
    • Company 
      • About us
        • Philosophy
        • History & Background
        • Team
        • International
        • Environment
          • Solder Recycling
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      • Know-How
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        • Apprenticeship programs
        • Job opportunities
      • Media / PR
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        • Press
        • Gallery
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      • Contact
        • Direct contact persons
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        • Almit’s Distributors
    almit-logo-web
    •  Login
    •  Registration
      • de Deutsch
      • en English
      • fr français
    • Technology
      • Top Sellers
        • Contactless soldering
        • Silver free alloy
        • Small area-ratio solder paste
        • Increased solder joint strength
        • Soldering tip-protecting alloy
        • Allrounder solder paste
        • Halogen-free with L1 quality
        • Dual boost for wetting
        • HALOGEN-FREE DUAL BOOST
        • Protection against copper leaching
      • Know-How
        • Compendium
        • Expert reports
        • Expertise
        • Product flyer
      • Almit Classifications
        • Solder wire lead free Flux & Alloy
        • Solder paste lead free Flux & Alloy
        • Solder wire leaded flux
        • Solder paste leaded
        • Solder bars and wires
        • Flux
      • Alloy Overview
      • Alloy Surcharge
      • PIEK and IPC-Training
      • Important notice
    • Shop
    • Solder wire
      • Solder wire lead free
        • LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
          •  DB-ZERO LFM-48M
          •  SRS-ZL LFM-48 S (3.5%)
          •  GUMMIX-19 NH LFM-48-S (3.5%)
          •  DB-1 RMA LFM-48M (3.5%)
          •  SR-38 RMA LFM-48 S (3.50%)
          •  GUMMIX-21 Zeta LFM-48-M (3,50%)
          •  BT-19 LFM-48 S (3.50%)
          •  QB-1 LFM-48 M 3.5%
          •  SR-LA Super LFM-48-M (3,50%)
          •  SR-37 LFM-48 S (4.50%)
          •  SR-37 LFM-48 S (3.50%)
          •  SR-37 LFM-48 S (2.50%)
          •  SR-55 LFM-48 S
        • LFM-22 S (Sn-0.7Cu+α) 228°C
          •  SR-37 LFM-22 S (3.50%)
        • LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
          •  SRS-ZL LFM-23 S (3.5%)
          •  DB1-RMA LFM-23S 3,5% Flux 3,5%
          •  QB-1 LFM-23S 3.5%
          •  SR-LA SUPER LFM 23-S (3.50%)
          •  SR-LA SUPER LFM 23-S (2.5%)
        • LFM-41 S (Sn-0.3Ag-2.0Cu+α) 217-271°C
          •  SR-37 LFM-41 S (3.50%)
        • LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  Gummix HF LFM 48
          •  GUMMIX-19 NH LFM-48 (3.50%)
          •  GUMMIX-SB RMA LFM-48 (3.50%)
          •  KR-19 SH RMA LFM-48 (3.50%)
          •  SR-37 LFM-48 (3.50%)
          •  KR-19 LFM-48 (3.50%)
        • SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
          •  SRS-RMA-NC SJM-03 S (3.50%)
          •  GUMMIX-21 Zeta SJM-03 S (3.50%)
          •  GUMMIX-21 Zeta SJM-03 S (2.50%)
          •  SR-LA SJM-03-S (3.50%)
      • Solder wire leaded
        • Sn63 (Sn-37.0Pb)
          •  SRC HM1 RMA Sn63 (9.50%)
          •  KR-19 RMA Sn63 (2.20%)
        • 60A (Sn-40Pb)
          •  KR-19 60A (2.20%)
          •  KR-19 SH RMA 60A (2.20%)
          •  GUMMIX-SB RMA 60A (2.20%)
        • Sn62 (Sn-2.0Ag-36.0Pb)
          •  KR-19 SH RMA Sn62 (2.20%)
        • Sn8 (Sn-92Pb)
          •  KR-28 Sn8 (2.20%)
      • GUMMIX Series
        • LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
          •  GUMMIX-21 Zeta LFM 23-S (3.50%)
        • LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  GUMMIX SB RMA LFM-48 (3.50%)
          •  Gummix HF LFM 48
          •  GUMMIX-19 NH LFM-48 (3.50%)
          •  GUMMIX-19 CH LFM-48 (3.50%)
        • LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
          •  GUMMIX-21 Zeta LFM-48-M (3,50%)
          •  GUMMIX-19 NH LFM-48-S (3.5%)
        • SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
          •  GUMMIX-21 Zeta SJM-03 S (3.50%)
      • Accessories
        • Desoldering braid
        • Tip cleaner
        • Flux removers
    • Solder paste
      • Solder paste lead free
        • LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  LFM-48 MR-NH (for aspect ration < 0,6)
          •  LFM-48W NH-GE
          •  LFM-48W NH-GE
          •  LFM 48 NH(LVA) (LVA=Low Void Additive)
          •  LFM-48 NH IMT (optimized print volume)
          •  LFM-48 GT(R)-SR 12%
          •  LFM-48 FS (for powder size 5.5)
          •  LFM-48 TM-HP (O) (long open time)
        • SJM-03 (Sn-0.3Ag-0.7Cu-2.0Bi) 210-226°C
          •  SJM-03 NH IMT (11.50%)
        • SJM-40 (Sn-4.0Ag-2.0Bi-3.0Sb) 221-227°C
          •  SJM-40
          •  SJM-40W NH(IMT)
          •  SJM-40W GT(R)-SR 12%
        • LFM-65 (Sn-58.0Bi) 139°C
          •  LFM-65W TM-HP(NC)
        • LFM-89 (Sn-57.6Bi-0.4Ag) 139°-141°C
        • LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
          •  LFM-70 INP (11%)
          •  LFM-70 INP (14%)
        • LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 194-206°C
          •  LFM-96W INP (11%)
      • Solder paste leaded
        • Sn62 (Sn-2.0Ag-36Pb)
          •  Sn62 SRC HM1 RMA (9.50%)
          •  Sn62 SRC HM1 RMA T3 (9.50%)
          •  Sn62 SRC HM1 RMA (12%)
          •  SRC Sn62U SS4M (15%) Mydata/Micronics Jet Paste
          •  SRC Sn62U SDL Flux 15% Jet Paste
        • SJ7 (Sn-34.5Pb-3.0Ag-0.5Sb)
          •  SJ7 HA2-RA (10%)
      • Dispenser Paste
        • LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
          •  LFM-48U SDK(NH) 15%.Jet Paste
          •  LFM-48 NH-MDL for very high temperature gradient
          •  LFM-48W NH Dispensing paste
          •  LFM-48U MDA-5 (10-28µm) Jet Paste for Mydata/Mycronic
          •  LFM-48U SDK (10-28µm) Jet Paste
          •  LFM-48U MJD Jet Paste
          •  LFM 48 GT Dispensing Paste
          •  LFM-48 SSI-M for very high temperature gradient
        • LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
          •  LFM 70 INP Dispenser Paste
        • LFM-89 (Sn-58.0Bi-0.4Ag) 139°C-168°C
          •  LFM-89 NH-MDL Micro-Dispensing Lasersoldering
        • Sn62 (Sn-2.0Ag-36Pb) 179-190°C
          •  SRC Sn62U SS4M (15%) Mydata/Mycronic Jet Paste
          •  SRC Sn62U SDL Flux 15% Jet Paste
          •  Sn62 SRC HM1 RMA (12%)
      • Accessories
        • Solder paste spatula ESD safe
        • Solder paste softener
    • Solder bars
      • Solder bars and solid wire
        • LFM-22 H (Sn-0.7Cu)
        • LFM-48 H (Sn-3.0Ag-0.5Cu)
        • LFM-59 H (Sn 3.0Cu)
        • LFM-62 H (Sn-3,0Cu-0,5Ni)
    • Flux
      • Flux
        • BM-1 RMA
        • BM-5000 RMA
        • RC-15SH RMA
        • RC-281 PF
    • Applications
      • Laser soldering
        • Solder wire
          •  GUMMIX SB RMA LFM-48 217-220°C
          •  GUMMIX-21 Zeta LFM 23-S (3.50%) 228°C
          •  Gummix HF LFM 48
        • Solder Paste
          •  LFM-48 SSI-M (14%) 217-220°C
    • Company
      • About us
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      Sponsoring

      • You are here
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      • Sponsoring
      Team_Executives

      Almit is a sponsor of the IPC Hand Soldering Competition

      IPC enables reliable, high-quality electronics by developing trusted standards that drive the success of the global electronics industry. These standards, which are applied throughout the industry, communicate and clarify requirements for everyone in the industry. IPC standards help ensure superior quality, reliability and consistency in electronics manufacturing.

      For many years, Almit has sponsored the IPC Hand Soldering Competition. The soldering competition uses wires from Almit's high-performance portfolio.

      Experienced soldering experts compete against each other for 60 minutes on a complex PCB assembly to win the national round title, receive a cash prize and secure a coveted spot in the IPC Hand Soldering World Championship finals.

      The participants are judged by IPC Master Instructors (MIT) according to the criteria of IPC-A-610 Class 3. Other criteria include the quality of the results achieved and the assembly process, the overall electrical functionality of the assembly and the speed with which the result was achieved.

       
       
      Team_Administration

      The competition will take place at the following trade fairs in 2025. You can register for participation via the links!

      • Southern Manufacturing & Electronics Show IPC Hand Soldering Competition UK 04-06/02/2025 Farnborough, UK
      • Global Industrie Lyon IPC Hand Soldering Competition France 11-14/03/2025 Lyon, FR
      • Innoelectro IPC Hand Soldering Competition Hungary 08-10/04/2025 Budapest, HU
      • IPC Hand Soldering Competition Italy 21-22/05/2025 Vincenza, IT
      • IPC Hand Soldering Competition Estonia Tallinn, EST
      • Productronica IPC Hand Soldering Competition Germany + European Final 18-21/11/2025 Munich, DE
      Almit | Solder | Solder paste | Lead free | SAC | Flux | Soldering | Laser soldering | Selective soldering

      Product overview

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      Almit GmbH

      Unterer Hammer 3
      DE 64720 Michelstadt,
      Germany.

      •  +49 (0) 6061 96925 0
      •  +49 (0) 6061 96925 18
      •  info@almit.de

      Mo-Th: 08-12 h. 13-17 h
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