Almit Solder Wire Lead Free Flux & Alloy classification

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Solder Wire Lead Free Flux & Alloy

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Flux of lead-free cored solder wires

Flux	Classification	Application	Application example
GUMMIX-19 NH	J-STD-004 1.2: RE L0	laser soldering, iron-tip soldering	wetting similar to L1
GUMMIX-21 NH	J-STD-004 1.2: RE L0	laser soldering, iron-tip soldering	low environment temperature
NHR-TH	J-STD-004 1.2: RO L0 100% halogenfrei	iron tip soldering, induction soldering	TH solder joints
BT-19	J-STD-004 1.2: RE L1 hoher Oberfächenwiderstand	iron tip soldering, induction soldering	TH solder joints
GUMMIX-21 Zeta	J-STD-004 1.2: RE L1	laser soldering, iron-tip soldering	for low-silver alloys
GUMMIX-SB RMA	J-STD-004 1.2: RE L1	laser soldering, iron-tip soldering	high temperature stability
SR-38 RMA	J-STD-004 1.2: RE L1 chlor- und bromfrei	iron tip soldering, induction soldering	TH solder joints
SRS-RMA NC	J-STD-004 1.2: RO L1 chlor- und bromfrei	iron tip soldering, induction soldering	TH solder joints
SSA-RMA	J-STD-004 1.2: RO L1	iron tip soldering, induction soldering	TH solder joints
GUMMIX-19 CH	J-STD-004 1.2: RE M1	laser soldering, iron-tip soldering	surfaces which are difficult to wet
G-14	J-STD-004 1.2: RE M1	Robot-continious soldering	multi-pin parts, high SIR
KR-19	J-STD-004 1.2: RO M1	iron tip soldering, induction soldering	Ni surface, stainless steel
SR-34 SUPER	J-STD-004 1.2: RE M1	iron tip soldering, induction soldering	TH solder joints
SR-37	J-STD-004 1.2: RE M1	iron tip soldering, induction soldering	Ni surface
SR-LA	J-STD-004 1.2: RO M1	iron tip soldering, induction soldering	TH solder joints
SRS-UL	J-STD-004 1.2: RO M1 chlor- und bromfrei	iron tip soldering, induction soldering	TH solder joints
SW-09	J-STD-004 1.2: OR H0	iron tip soldering, induction soldering	water washable

lead-free solder wire alloys at a glance

Alloy	Composition	Melting range	Special advantages
LFM-22	Sn-0.7Cu	227ºC	Sn-Cu eutectic
LFM-22 S	Sn-0.7Cu-0.04Fe	228ºC	anti tip-wastage, Sn-Cu eutectic
LFM-34	Sn-3.5Ag	221ºC	Sn-Ag eutectic
LFM-41	Sn-0.3Ag-2.0Cu	217–270ºC	minimizes Cu leaching
LFM-41 S	Sn-0.3Ag-2.0Cu-0.04Fe	217–271ºC	anti tip-wastage, minimizes Cu leaching
LFM-48	Sn-3.0Ag-0.5Cu	217–220ºC	SAC, JEITA recommended
LFM-48 S	Sn-3.0Ag-0.5Cu-0.04Fe	217–221ºC	anti tip-wastage, SAC, JEITA recommended
LFM-48 M	Sn-3.0Ag-0.5Cu-0.03Fe-α	217–221ºC	anti tip-wastage and avoiding oxidization
LFM-59	Sn-3.0Cu	227–312ºC	minimizes Cu leaching
LFM-74	Sn-10.0Sb	246–258ºC	higher melting range, Sn, Sb
LFM-86	Sn-3.9Ag-0.7Cu	217–218ºC	low Ag, SAC
LFM-86 S	Sn-0.3Ag-0.7Cu-0.04Fe	217–228ºC	anti tip-wastage, low Ag, SAC
SJM-03 S	Sn-0.3Ag-0.7Cu-2.0Bi-0.035Fe	210–226ºC	anti tip-wastage, low AG, high solder joint strength
SJM-10 S	Sn-1.0Ag-0.7Cu-2.0Bi-0.035Fe	212–224ºC	anti tip-wastage, low AG, high solder joint strength
SJM-30	Sn-3.0Ag-2.0Bi-1.0Sb	216–224ºC	high solder joint strength
SJM-35	Sn-3.5Ag-2.0Bi	216–220ºC	high AG, high solder joint strength
SJM-40^*	Sn-4.0Ag-2.0Bi-3.0Sb-α	221–227ºC	high AG, very high solder joint strength

^*SJM-40 is patented under: JP PAT Nr. 3045453