Solder Wire Lead Free Flux & Alloy

Flux of lead-free cored solder wires

Flux Classification Application Application example
GUMMIX-19 NH J-STD-004 1.2: RE L0 laser soldering, iron-tip soldering wetting similar to L1
GUMMIX-21 NH J-STD-004 1.2: RE L0 laser soldering, iron-tip soldering low environment temperature
NHR-TH J-STD-004 1.2: RO L0
100% halogenfrei
iron tip soldering, induction soldering TH solder joints
BT-19 J-STD-004 1.2: RE L1
hoher Oberfächenwiderstand
iron tip soldering, induction soldering TH solder joints
GUMMIX-21 Zeta J-STD-004 1.2: RE L1 laser soldering, iron-tip soldering for low-silver alloys
GUMMIX-SB RMA J-STD-004 1.2: RE L1 laser soldering, iron-tip soldering high temperature stability
SR-38 RMA J-STD-004 1.2: RE L1
chlor- und bromfrei
iron tip soldering, induction soldering TH solder joints
SRS-RMA NC J-STD-004 1.2: RO L1
chlor- und bromfrei
iron tip soldering, induction soldering TH solder joints
SSA-RMA J-STD-004 1.2: RO L1 iron tip soldering, induction soldering TH solder joints
GUMMIX-19 CH J-STD-004 1.2: RE M1 laser soldering, iron-tip soldering surfaces which are difficult to wet
G-14 J-STD-004 1.2: RE M1 Robot-continious soldering multi-pin parts, high SIR
KR-19 J-STD-004 1.2: RO M1 iron tip soldering, induction soldering Ni surface, stainless steel
SR-34 SUPER J-STD-004 1.2: RE M1 iron tip soldering, induction soldering TH solder joints
SR-37 J-STD-004 1.2: RE M1 iron tip soldering, induction soldering Ni surface
SR-LA J-STD-004 1.2: RO M1 iron tip soldering, induction soldering TH solder joints
SRS-UL J-STD-004 1.2: RO M1
chlor- und bromfrei
iron tip soldering, induction soldering TH solder joints
SW-09 J-STD-004 1.2: OR H0 iron tip soldering, induction soldering water washable

lead-free solder wire alloys at a glance

Alloy Composition Melting range Special advantages
LFM-22 Sn-0.7Cu 227ºC Sn-Cu eutectic
LFM-22 S Sn-0.7Cu-0.04Fe 228ºC anti tip-wastage, Sn-Cu eutectic
LFM-34 Sn-3.5Ag 221ºC Sn-Ag eutectic
LFM-41 Sn-0.3Ag-2.0Cu 217–270ºC minimizes Cu leaching
LFM-41 S Sn-0.3Ag-2.0Cu-0.04Fe 217–271ºC anti tip-wastage, minimizes Cu leaching
LFM-48 Sn-3.0Ag-0.5Cu 217–220ºC SAC, JEITA recommended
LFM-48 S Sn-3.0Ag-0.5Cu-0.04Fe 217–221ºC anti tip-wastage, SAC, JEITA recommended
LFM-48 M Sn-3.0Ag-0.5Cu-0.03Fe-α 217–221ºC anti tip-wastage and avoiding oxidization
LFM-59 Sn-3.0Cu 227–312ºC minimizes Cu leaching
LFM-74 Sn-10.0Sb 246–258ºC higher melting range, Sn, Sb
LFM-86 Sn-3.9Ag-0.7Cu 217–218ºC low Ag, SAC
LFM-86 S Sn-0.3Ag-0.7Cu-0.04Fe 217–228ºC anti tip-wastage, low Ag, SAC
SJM-03 S Sn-0.3Ag-0.7Cu-2.0Bi-0.035Fe 210–226ºC anti tip-wastage, low AG, high solder joint strength
SJM-10 S Sn-1.0Ag-0.7Cu-2.0Bi-0.035Fe 212–224ºC anti tip-wastage, low AG, high solder joint strength
SJM-30 Sn-3.0Ag-2.0Bi-1.0Sb 216–224ºC high solder joint strength
SJM-35 Sn-3.5Ag-2.0Bi 216–220ºC high AG, high solder joint strength
SJM-40* Sn-4.0Ag-2.0Bi-3.0Sb-α 221–227ºC high AG, very high solder joint strength

*SJM-40 is patented under: JP PAT Nr. 3045453