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CCB stands for Controlled Collapse Bonding. This is a method developed by L. F.Millerand others at the IBM in which the molten solder changes shape due to its surface tension under the influence of a fluxing agent. The figure represents the process graphically and shows the solders in the right place after soldering in the reflow oven. This corresponds to theself-alignment effect during soldering. See also Self-alignment effect.