Fatigue fractures are an inevitable consequence of low-silver alloys? No, that's not true. Meet the SJM series from Almit. A patented lead-free alloy that guarantees absolute reliability and high strength even at high temperature cycling.The SJM-03 alloy (Sn-0.3Ag-0.7Cu-2.0Bi-a, melting range 210-225°C) has a low silver content. The application of this solder paste ensures high solder joint strength. Our flux NH (IMT) (classification ROL0) is 100% halogen free. It has the characteristics of an L1 flux and ensures that this paste provides perfect results even after a long open time. Reduces defects during the SMT process. Better wetting on metals that are difficult to wet. Large process window & designed for PIP. Very good printing on small devices& improved settings for intermittent printing.
Lead free solder paste, Sn-0.3Ag-0.7Cu-2.0Bi-a, 210-225°C, ROL0, Flux 11.5%, 100% halogen free.