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Solder wire
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- Solder wire lead free
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» LFM-48 S+M (Sn-3.0Ag-0.5Cu+α) 217-221°C
- SRS-ZL LFM-48 S (3.5%)
- NHR-TH LFM-48 M (3.5+2.5+1.5%)
- NHR-1 LFM-48 S (3.50%)
- GUMMIX-19 NH LFM-48-S (3.5%)
- DB-1 RMA LFM-48M (3.5%)
- SRS-RMA-NC LFM-48-S (3,50%)
- SR-38 RMA LFM-48 S (3.50%)
- GUMMIX-21 Zeta LFM-48-M (3,50%)
- BT-19 LFM-48 S (3.50%)
- QB-1 LFM-48 M 3.5%
- SR-LA Super LFM-48-M (3,50%)
- SR-37 LFM-48 S (4.50%)
- SR-37 LFM-48 S (3.50%)
- SR-37 LFM-48 S (2.50%)
- SR-55 LFM-48 S
- » LFM-22 S (Sn-0.7Cu+α) 228°C
- » LFM-23 S (Sn-0.6Cu-0.05Ni-0.035Fe) 228-229°C
- » LFM-41 S (Sn-0.3Ag-2.0Cu+α) 217-271°C
- » LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
- » SJM-03 S (Sn-0.3Ag-0.7Cu+2.0Bi+α) 210-226°C
- » LFM-86 S (Sn-0.3Ag-0.7Cu+α) 217-227°C
- » LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 200-210°C
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Solder paste
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- Solder paste lead free
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» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
- LFM-48 MR-NH (for aspect ration <0,6)
- LFM 48 NH(LVA) (LVA=Low Void Additive)
- LFM-48 NH IMT (optimized print volume)
- LFM-48 GT(R)-SR 12%
- LFM-48 SUC-UI (for high preheating)
- LFM-48 TM-HP (Forerunner of the GT family)
- LFM-48 TM-HP L (Forerunner of the GT family)
- LFM-48 TM-HP S (High speed printing up to 200mm/sec)
- LFM-48 TM-HP (O) (long open time)
- » SJM-03 (Sn-0.3Ag-0.7Cu-2.0Bi) 210-226°C
- » SJM-40 (Sn-4.0Ag-2.0Bi-3.0Sb) 221-227°C
- » LFM-65 (Sn-58.0Bi) 139°C
- » LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
- » LFM-86 (Sn-0.3Ag-0.7Cu) 217-227°C
- » LFM-96 (Sn-3.5Ag-0.5Bi-6.0In) 194-206°C
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- Dispenser Paste
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» LFM-48 (Sn-3.0Ag-0.5Cu) 217-220°C
- LFM-48U SDK(NH) 15%.Jet Paste
- LFM-48 NH-MDL for very high temperature gradient
- LFM-48W NH Dispening paste
- LFM-48U MDA-5 (10-28µm) Jet Paste for Mydata/Mycronic
- LFM-48U SDK (10-28µm) Jet Paste
- LFM-48U MJD Jet Paste
- LFM-48 TM-HP Dispensing paste
- LFM 48 GT Dispensing Paste
- LFM-48 SSI-M for very high temperature gradient
- » LFM-70 (Sn-3.5Ag-0.5Bi-8.0In) 194-206°C
- » LFM-65 (Sn-58.0Bi) 139°C
- » LFM-89 (Sn-58.0Bi-0.4Ag) 139°C-168°C
- » SJM-40 DS-RMA (13.0%)
- » Sn62 (Sn-2.0Ag-36Pb) 179-190°C
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