Last week, we were part of the "Elmotec-SIEMENS Technology-Days Robot Soldering", with exciting lectures and expert discussions on the topic of robot soldering. Our managing director Michael Mendel held a presentation on the topic of "Solders and fluxes, requirements for robot soldering".
This event came about through the cooperation of Siemens with our partner Elmotec, in the course of the implementation of the SolderSmart soldering robot in the THT production at Siemens. The SolderSmart soldering robots are equipped with our new high-performance solder wire DB-1. Therefore, we were happy to contribute our expertise to the event. Four members of our Japanese research and development team also travelled to the event, including the primary person responsible for DB-1 development.
You can find more information about the DB-1 in the current issue of our customer magazine https://www.almit.de/customer-magazine or at https://www.almit.de/dual-boost-for-wetting.
We would like to thank Elmotec once again for hosting this event and look forward to continued successful cooperation.
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This event came about through the cooperation of Siemens with our partner Elmotec, in the course of the implementation of the SolderSmart soldering robot in the THT production at Siemens. The SolderSmart soldering robots are equipped with our new high-performance solder wire DB-1. Therefore, we were happy to contribute our expertise to the event. Four members of our Japanese research and development team also travelled to the event, including the primary person responsible for DB-1 development.
You can find more information about the DB-1 in the current issue of our customer magazine https://www.almit.de/customer-magazine or at https://www.almit.de/dual-boost-for-wetting.
We would like to thank Elmotec once again for hosting this event and look forward to continued successful cooperation.