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Initially, reflow was used for referring to the remelting solder layer. Nowadays, it is used for referring to the heating of a solder-flux combination which has been previously placed in the desired location to form a solder joint. There is hardly any difference between Reflow soldering and actual soldering (H. H. Manko: Soldering Handbook for Printed Circuit and Surface Mounting, p. 192). In surface mounting (SMT), far-infrared radiation is used for melting the solder in the reflow process because it allows to selectively heat individual spots without affecting the rest of the circuit board. Far-infrared radiation is normally generated by heating a ceramic-coated (Fe2 O3) Nichrome wire.