Soldering terminology

Figure A shows the state after brazing of two parts. At the junction a considerable amount of solder is available . Figure B was taken after pressing at the melting temperature of the solder. Most of the solder is forced out of the gap and the parts are connected to each other almost without any solder layer. As the figure shows, rapid heating of the components allows the connection of the presses through electrical resistance. This topic is discussed in the following research: Hattori, Funamoto, Shida (Hitachi Ltd.), "Properties of Joints during Press Soldering with Resistance Heating", essay collection of the Japan Welding Society, Vol. 7 (1989 ), No. 3, p. 348 - 351.