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Hot air leveling
Hot air leveling is a new and advanced technology that will most likely proliferate in the future. In this case, a rigidly mounted circuit board is dipped into a solder bath in order to cover the exposed surfaces with solder. After the solder bath phase, two hot air knives are directed on the circuit board to blow the excess solder off with temperatures above the melting point of the solder. In this manner, the contact holes are cleaned and the tin or tin/lead layer is evenly distributed on the circuit board so that a flat surface is formed.