Globule test  Go To Index Grain size  

    Grabstein effect (tombstoning)

    During the soldering of components, particularly when working with leadless chips, it may happen that after one side has already been soldered to the intended location, the other end lifts and the component will be mounted askew onto the circuit board. In such a case, the chip resembles a grave, which is why the effect has been given this name. See also Manhattan effect.