Terminologie des Lötens

In solderingwithcoredsolder, the temperature of the solderbringsthe fluxinside thesolderto boil, making it splash apartas soon asthesurroundingsolder shell melts away,and solder bumps form as a result.To prevent this,aV-shapedincision is made along the axis of thecored solder,allowing thefluxto evaporate when the cored solder melts,without triggering explosive soldersplashes.However, the incised cored solderscannot bestored for longbecausethe fluxoxidizes.Therefore, theincision isusuallycarried out just beforesoldering. See alsoSplashing.