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    Cold solder joint

    Concept used in practice describing a solder joint that was exposed to movement or vibration before complete solidification of the solder. As a result, the solder joint is replaced by a rough surface and the solder joint is inadequate and mechanically unstable . In order to prevent shifts of the components as far as possible, rapid solidification, i.e. a short persistence of the solder in the viscous state (pasty state) is required, especially in mass production during soldering.