With speed and persistence to the optimal result!
With the combination of a fast-acting and a persistent activator, the solder wire innovation DB-1 RMA offers a double boost for a new dimension of wettability. In this way, you achieve a reduction in process time and a long-term decrease in production costs, even with oxidised components. The alloy SJM-03 S (Sn-0.3Ag-0.7Cu-2.0Bi-0.035Fe, melting range 210-226°C) has a low silver content. The use of this solder wire protects the soldering tip and ensures high solder joint strength.
Leadfree solder wire, Sn-0.3Ag-0.7Cu-2.0Bi-0.035Fe, 210-226°C, ROL1, no clean
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