You think soldering defects in the SMT-process cannot be prevented? This is just not true. Discover the GT-R and NH-IMT solder pastes. They guarantee optimal wetting on a wide variety of surface materials and keep high yield by minimising soldering defects. In addition, they have a very good print even on the smallest structures and are also designed for PIP/THR, among other things. NH-IMT in particular is convincing despite its L0 classification with its very good flow behaviour on many different surfaces.
The alloy LFM-48 (Sn-3.0Ag-0.5Cu, melting range 217-220°C) is a SAC alloy and is recommended by the Japan Electronics and Information Technology Industries Association (JEITA).
Leadfree solder paste, 25 - 45µm, Sn-3,0Ag-0,5Cu, 217° - 220°C, Flux No clean.