Minimize Defects on SMT process. Better wetting on unique metal. Wide process window & disigned for PIP. Good priting on small appertures & improve interval printing property.You think soldering defects in the SMT process cannot be avoided? No, that's not true. Discover NH-IMT, the L0 all-rounder among our solder pastes. Despite L0 classification, NH-IMT convinces with very good flow behavior and optimal wetting on many different surfaces and is thus in no way inferior to an L1 paste. NH-IMT minimizes soldering defects, has a very good pressure even on smallest structures and is also designed for PIP/THR.
The alloy LFM-48 (Sn-3.0Ag-0.5Cu, melting range 217-220°C) is a SAC305 alloy and is recommended by the Japan Electronics and Information Technology Industries Association (JEITA).
Lead free solder paste, 25-45µm Sn-3.0Ag-0.5Cu, 217° - 220°C, ROL0, 11.5%