The silver-free high-performance alloy, LFM-23 S has the best characteristics of an SnCuNi alloy. High-quality, reliable and cost-efficient. With a decisive plus: an innovative iron-gallium compound in LFM-23 S reduces oxidation and minimises iron erosion on the soldering tip. The soldering tip lifetime is up to five times longer and therefore contributes to a reduction in costs in production.
Leadfree solder wire, Sn-0,6Cu--0,05Ni-0,035Fe, 228° - 229°C, Flux 3,5%, REL1, Anti tip wastage, no clean