You think soldering defects in the SMT process cannot be avoided? No, that's not true. Discover GT(R)-S, the L1 all-rounder among our solder pastes. This paste guarantees optimum wetting on a wide variety of surface materials and minimizes soldering defects. In addition, it has a very good print even on the smallest structures and is also designed for PIP/THR, among other things.
The alloy LFM-48 (Sn-3.0Ag-0.5Cu, melting range 217-220°C) is a SAC alloy and is recommended by the Japan Electronic Industry Development Association (JEIDA).
Leadfree solder paste, 20 - 38µm, Sn-3,0Ag-0,5Cu, 217° - 220°C, Flux 13%, ROL1 No clean.