You think soldering defects in the SMT process cannot be avoided? Well, that's not true. Discover GT(R)-S, the L1 all-rounder among our solder pastes. This paste guarantees optimal wetting on a wide variety of surface materials and minimises soldering defects. In addition, it has a very good pressure even on the smallest structures and is also designed for PIP/THR, among other things. Furthermore, with our patented lead-free and low-silver SJM alloy, we can guarantee absolute reliability and high strength even at high temperature changes.
Leadfree solder paste, 20 - 38µm, Sn-0,3Ag-0,7Cu-2,0Bi-0,01Fe, 210° - 225°C, Flux 12%, ROL1, No clean