Soldering terminology

Referred to particularly small solder drops or threads on isolated areas of the circuit board or between the metallic terminal pads. The irregular shape compared to ordinary solder joints on PCBs is due to the smaller amount of fluxing agent used here.

Network formation has four root causes:

1. faulty curing of resins in laminated PCBs or of solder resist on the board;

2. creation of rough surfaces by rubbing too strongly ; corrosion due to use of inappropriate solvent or solder resist;

3. lack of fluxing agents upon contact with solder dross and solder balls created on PCBs;

4. general lack of fluxing agent. To prevent this, it is useful to determine the density and the amount of the flux in advance.