Lead-Free Solder Wires

Lead-Free Solder Wires

Bleifrei

A more rapid wetting, an absolute consistency of quality and specific procedures made Almit one of the leading suppliers of solder wires for manual and robot soldering. Only the best and purest of material is used that guarantees a consistent quality - from the beginning to the end of each solder wire coil. The flux contains a highly-efficient wetting agent based on natural resin, the natural water content of which has been dehydrated through a special process. This serves to reduce the danger of tin and flux agent spit back, a troublesome problem that can lead to short-circuit bridges and reduced quality. The unique flux provides for fault-free and efficient soldering, even on oxidized component connections. The patented active flux components are faster than others in eliminating the oxide layer and provide for an extremely fast wetting of the connections. This level of quality is achieved through Almit"s proven consistency. Less solder wire is consumed while producing more output at even reduced reject rates. This results in increased productivity at lower costs.

 Lead-Free Solder Wire - Overview

Name Composition Properties
SRS-RMA-NC SJM-03-S Sn0.3Ag0.7Cu2.0Bi0.035Fe
  • Fusion point 210 - 225°C
  • Almit patented alloy
  • Low silver content
  • High solder joint strenght
  • Reduces soldering tip wear
  • Flux agent L0 classified
  • Available diameter 0.3-2.0mm
NHR-TH LFM 48S Sn3.0Ag0.5Cu0.04Fe
  • Fusion point 217 - 221°C
  • Almit patented alloy
  • Halogen-free
  • Improved cutting property
  • Minimize flux spitting dramatically
  • Reduces soldering tip wear
  • Flux agent L0 classified
  • Available diameter 0.3-1.6mm
BT 19 LFM-48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • rapid wetting even on problematic surfaces
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
BT 19 LFM-48S Sn3.0Ag0.5Cu
  • Fusion point 217 - 221°C
  • rapid wetting even on problematic surfaces
  • Reduced soldering tip wear
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
GUMMIX SB RMA LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Developed especially for laser robot applications
  • Flux agent L1 classified
  • Available diameter 0.3mm - 2.0mm
GUMMIX 19NH Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Developed especially for laser robot applications
  • Halogen-free
  • Anti-flux dispersion, anti-residual peeling and good workability
  • Flux agent L0 classified
  • Available diameter 0.5mm - 1.0mm
GUMMIX 21NH Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Developed especially for laser robot applications
  • Halogen-free
  • Anti-flux dispersion and improved anto-residual peeling
  • Flux agent L0 classified
  • Available diameter 0.5mm - 1.0mm
HR 19M LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Flux agent M1 classified
  • Available diameter 0.3mm - 1.6mm
KR 19 LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • suitable for wetting-resistant material such as high-grade steel
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
KR 19SH RMA LFM 22 Sn0.7Cu
  • Fusion point 227°C
  • Eutektik Solder
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
KR 19SH RMA LFM 34 Sn3.5Ag
  • Fusion point 221°C
  • Eutektik Solder
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
KR 19SH RMA LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
SR 34 LFM 22 Sn0.7Cu
  • Fusion point 227°C
  • Eutektik Solder
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
SR 34 LFM 34 Sn3.5Ag
  • Fusion point 221°C
  • Eutektik Solder
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
SR 34 SUPER LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm 
SR 37 LFM 22S Sn0.7Cu
  • Fusion point 227°C
  • Eutektik Solder
  • very rapid wetting even on problematic surfaces
  • Reduced soldering tip wear
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
SR 37 LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • very rapid wetting even on problematic surfaces
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm 
SR 37 LFM 48S Sn3.0Ag0.5Cu
  • Fusion point 217 - 221°C
  • very rapid wetting even on problematic surfaces
  • rapid wetting even on problematic surfaces
  • Reduced soldering tip wear
  • Flux agent M1 classified
  • Available diameter 0.15mm - 2.7mm
SR 37 LFM 86 Sn0.3Ag0.7Cu
  • Fusion point 217 - 228°C
  • rapid wetting even on problematic surfaces
  • Flux agent M1 classified
  • Available diameter 0.3mm - 2.0mm
SR 37 LFM 86S Sn0.3Ag0.7Cu
  • Fusion point 217 - 228°C
  • rapid wetting even on problematic surfaces
  • Reduzierung der Lötspitzenabnutzung
  • Flux agent M1 classified
  • Available diameter 0.3mm - 2.0mm
SR 38 RMA LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • rapid wetting
  • rapid wetting even on problematic surfaces
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
SR 38 RMA LFM 48S Sn3.0Ag0.5Cu
  • Fusion point 217 - 221°C
  • rapid wetting even on problematic surfaces
  • rapid wetting
  • Reduced soldering tip wear
  • Flux agent L1 classified
  • Available diameter 0.2-2.7mm
SR 55 LFM 48 Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
  • extrem rapid wetting
  • rapid wetting even on problematic surfaces
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
SR 55 LFM 48S Sn3.0Ag0.5Cu
  • Fusion point 217 - 221°C
  • Extremely fast wetting even on problematic surfaces such as Nickel
  • rapid wetting even on problematic surfaces
  • Reduced soldering tip wear
  • Flux agent M1 classified
  • Available diameter 0.2-2.7mm
SR 55 LFM 86 Sn0.3Ag0.7Cu
  • Fusion point 217 - 228°C
  • rapid wetting even on problematic surfaces
  • Flux agent M1 classified
  • Available diameter 0.3mm - 2.0mm
SR 55 LFM 86S Sn0.3Ag0.7Cu
  • Fusion point 217 - 228°C
  • rapid wetting even on problematic surfaces
  • Reduced soldering tip wear
  • Flux agent M1 classified
  • Available diameter 0.3mm - 2.0mm
NHR-1 LFM 48S Sn3.0Ag0.5Cu
  • Fusion point 217 - 221°C
  • Good workability
  • Halogen-free
  • Flussmittel L0 klassifiziert
  • Available diameter 0.2-2.7mm

Lead-Free Solder Blocks - Overview

Name Composition Properties
LFM-22H Sn0.7Cu
  • Fusion point 227°C
  • Eutektik Solder
LFM-34H Sn3.5Ag
  • Fusion point 221°C
  • Eutektik Solder
LFM-48H Sn3.0Ag0.5Cu
  • Fusion point 217 - 220°C
LFM-59H Sn3.0Cu
  • Fusion point 217 - 312°C
  • Copper leaching
LFM-62H Sn3.0Cu0.5Ni
  • Fusion point 217 - 394°C
  • Copper leaching
LFM-82H Sn3.9Ag0.6Cu
  • Fusion point 217 - 218°C
LFM-86H Sn0.3Ag0.7Cu
  • Fusion point 217 - 228°C