Lead-Free Solder Pastes

Lead-Free Solder Pastes

Bleifrei

Almit Lead-Free Solder Pastes - consistent high quality and premium wetting properties. The flux contains a highly efficient wetting agent based on natural resin, the natural water content of which has been dehydrated through a special process. This serves to reduce the danger of tin and flux agent spit back, a troublesome problem that can lead to short-circuit bridges and reduced quality. The unique flux provides for fault-free and efficient soldering, even on oxidized component connections. The patented active flux components are faster than others in eliminating the oxide layer and provide for an extremely fast wetting of connection.

This level of quality is achieved through Almit"s proven consistency. Less solder wire is consumed while producing more output at even reduced reject rates. This results in increased productivity at lower costs.

Lead-Free Pastes - Overview

Name Composition Properties
SJM-03 NH(EB) Sn0.3Ag0.7Cu2.0Bi0.01Fe
  • Fusion point 210-225°C
  • 100% halide-free
  • Improve continuous printing & stable deposit
  • Upgrade wetting of fine powder
  • Minimize solder ball
  • Flux agent L0 classified
  • Available in particle size 4,5
LFM 48 TM-HP Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Outstanding print result
  • A very high pre-heating temperature of up to 200°C is possible
  • In compliance with AQP requirements
  • Very good wetting properties
  • Flux agent L1 classified
  • Available in particle size 3,4,5
LFM 48 TM-HP(K) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 TM-HP(L) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Excellent form-retaining properties on the stencil plate
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 TM-HP(M) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Highly activated flux agent
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 TM-HP(P) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Highly activated flux agent
  • Suitable for wetting-resistant material
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 TM-HP(S) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • High-velocity printing
  • Possible print speeds of up to 125mm/s
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 TM-HP(Y) Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Good wetting properties
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 MHS30 Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Flux agent L0 classified
  • Available in particle size 3,4
LFM48 SSIM Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Developed for Spot-Reflow applications
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48N FS Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Flux agent L1 classified
  • Available in particle size 6
LFM 48 PMK Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 48 GUMMIX Sn3.0Ag0.5Cu
  • Fusion point 217-220°C
  • No flux agent "spit back"
  • No need for flux residue removal after soldering
  • Flux agent L1 classified
  • Available in particle size 3,4
  • Available as of January 2008
LFM 31 MHS32 Sn3.0Bi8.0Zn
  • Fusion point 190-199°C
  • Low melting solder paste
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 34 TM-HP Sn3.5Ag
  • Fusion point 221°C
  • Outstanding print result
  • Eutektik Solder
  • A very high pre-heating temperature of up to 200°C is possible
  • Very good wetting properties
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 52 IBL Sn3.5Ag0.5Bi3.0In
  • Fusion point 207-214°C
  • Low melting solder paste
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 57 TM-HP Sn5.0Sb
  • Fusion point 235-240°C
  • High-temperature solder
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 65 A75C Sn58.0Bi
  • Fusion point 139°C
  • Low melting solder paste
  • Eutektik Solder
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 14 TM-HP Sn3.5Ag0.7Cu
  • Fusion point 217-218°C
  • Outstanding print result
  • A very high pre-heating temperature of up to 200°C is possible
  • Very good wetting properties
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 14 TM-HP(L) Sn3.5Ag0.7Cu
  • Fusion point 217-218°C
  • Excellent form-retaining properties on the stencil plate
  • Flux agent L1 classified
  • Available in particle size 3,4,5
LFM 14 MHS30 Sn3.5Ag0.7Cu
  • Fusion point 217-218°C
  • Flux agent L0 classified
  • Available in particle size 3,4
LFM 70 INP Sn3.5Ag0.5Bi8.0In
  • Fusion point 194-206°C
  • Low melting solder paste
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 71 IBL Sn3.5Ag0.5Bi4.0In
  • Fusion point 205-212°C
  • Low melting solder paste
  • Flux agent L1 classified
  • Available in particle size 3,4
LFM 82 TM-HP Sn3.9Ag0.6Cu
  • Fusion point 217-218°C
  • Outstanding print result
  • A very high pre-heating temperature of up to 200°C is possible
  • Very good wetting properties
  • Flux agent L1 classified
  • Available in particle size 3,4