Lead-Containing Solder Pastes

Lead-Containing Solder Pastes

Bleifrei

Constant quality and premium wetting properties are the characteristics that are typical for Almit Solder Pastes. Only the best and purest of material with uniform particle sizes are processed. This ensures that the features of the paste are always uniform, thus guaranteeing that always the same amount is applied to the stencil plate without having to readjust the stencil printer. The unique, patented paste composition efficiently eliminates the problem of paste sticking in the plate apertures, even in fine and super fine pitch below 0.5 mm structures. In the presence of shear forces, the paste demonstrates exceptionally low-friction properties, comparable to those of graphite. Thanks to the paste"s strong thixotrophic properties, it retains its precise form after the stencil plate is lifted off after the print. Nevertheless, the solder paste displays sufficient adhesiveness for the components to be adequately retained on the pads, even with the strong acceleration forces that are generated by some of the fastest placement machines acting on them.

Solder Pastes - Overview

Name Composition Properties
SJ-3Bi HM1 RMA V14L Sn57Sb0.5Ag1.5Bi3Pb38
  • Fusion point 171 - 181°C
  • Low melting solder paste
  • Particle sizes 25-45µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • For CSP/BGA
  • Available in 500g cans, 700g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag0.4 V14L T3 Sn62.8Ag0.4Pb36.8
  • Fusion point 179 - 190°C
  • Long open time and very good adhesiveness
  • Particle sizes 25-45µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • Transparent colourless flux agent residues
  • Available in 500g cans, 700g, 800g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag2 V14L T3 Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Long open time and very good adhesiveness
  • Silver protective solder
  • Particle sizes 25-45µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • Transparent colourless flux agent residues
  • Available in 500g cans, 700g, 800g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag2 V14L Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Silver protective solder
  • Particle sizes 25-45µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • Transparent farblose Flusmittelrückstände
  • Available in 500g cans, 700g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag2 V14L (Dispenser) Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Silver protective solder
  • Particle sizes 25-45µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 12%
  • Transparent colourless flux agent residues
  • Available in 5cc cartridge, 10cc cartridge, 30cc cartridge
SRC HM1 RMA Ag2 V16L T3 Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Long open time and very good adhesiveness
  • Silver protective solder
  • Particle sizes 20-38µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • Transparent colourless flux agent residues
  • Available in 500g cans, 700g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag2 V16L Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Silver protective solder
  • Particle sizes 20-38µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 9.5%
  • Transparent colourless flux agent residues
  • Available in 500g cans, 700g cartridges, 1.5kg cartridges
SRC HM1 RMA Ag2 V16L (Dispenser) Sn62Ag2Pb36
  • Fusion point 179 - 190°C
  • Silver protective solder
  • Particle sizes 20-38µm
  • Flux agent L1 classified, "No clean"
  • Flux agent content 12%
  • Transparent colourless flux agent residues
  • Available in 5cc cartridge, 10cc cartridge, 30cc cartridge