Lead-Containing Solder Wires

Lead-Containing Solder Wires

Bleifrei

A more rapid wetting, absolute consistency of quality and specific procedures made Almit one of the leading suppliers of solder wires for manual and robot soldering. Only the best and purest of material is used that guarantees a consistent quality - from the beginning to the end of each solder wire coil. The flux contains a highly-efficient wetting agent based on natural resin, the natural water content of which has been dehydrated through a special process. This serves to reduce the danger of tin and flux agent spit back, a troublesome problem that can lead to short-circuit bridges and reduced quality. The unique flux provides for fault-free and efficient soldering, even on oxidized component connections. The patented active flux components are more rapid than others in eliminating the oxide layer and provide for an extremely fast wetting of connection. This level of quality is achieved through Almit"s proven level of consistency. Less solder wire is consumed while producing more output at even reduced reject rates. This results in increased productivity at lower costs.

Lead-Containing Solder Wires - Overview

Name Composition Properties
GUMMIX 19 Sn60Pb40
  • Fusion area 183°c - 190°C
  • No flux agent "spit back"
  • No need for flux residue removal after soldering
  • Temperature stable, maintains its stability even at high operating temperatures
  • Flux agent M1 classified
  • Available diameter 0.5mm - 1.6mm
GUMMIX SB RMA Sn60Pb40
  • Fusion area 183°c - 190°C
  • No flux agent "spit back"
  • No need for flux residue removal after soldering
  • Temperature stable, maintains its stability even at high operating temperatures
  • Flux agent L1 classified
  • Developed especially for laser applications
  • Available diameter 0.3mm - 1.6mm
HR-19M Sn60Pb40
  • Fusion area 183°c - 190°C
  • Highly active flux agent
  • Ideally suited for soldering difficult metals (zinc/nickel-plated stainless steel)
  • Flux agent M1 classified
  • Available diameter 0.3mm - 2.0mm
KR-19SH RMA Sn60Pb40
  • Fusion area 183°c - 190°C
  • "No clean" solder wire for tightly packed SMT boards and robot applications
  • Flux agent L1 classified
  • Available diameter 0.3mm - 1.6mm
KR-19SH RMA Ag2 Sn62Pb36Ag2
  • Fusion point 179 - 188°C
  • Good wetting properties and high reliability
  • Flux agent L1 classified
  • Available diameter 0.3mm - 1.6mm
KR-19 SJ-7 Sn62Sb0.5Ag3Pb34.5
  • Fusion area 179 - 187°C
  • High-performance solder, three times higher tensile strength than Sn63
  • Suitable for aerospace applications
  • Suitable for application in electronics and in military areas
  • Flux agent M1 classified
  • Available diameter 0.3mm - 1.6mm
KR-19SH RMA SJ-7 Sn62Sb0.5Ag3Pb34.5
  • Fusion area 179 - 187°C
  • High-performance solder, three times higher tensile strength than Sn63
  • Suitable for aerospace applications
  • Suitable for application in electronics and in military areas
  • Flux agent L1 classified
  • Available diameter 0.3mm - 1.6mm
KR-15 Sn43Pb43Bi14
  • Fusion area 135 - 165°C•
  • Low melting solder
  • Flux agent M1 classified
  • Available diameter 1.0mm
KR-28 Sn8Pb92
  • Fusion area 280 - 305°C•
  • High melting solder
  • Flux agent M1 classified
  • Available diameter 0.8mm - 1.6mm