Flux | Flux classification | Particular advantage |
NH (LVA) 100% halide-free |
ROL0 | reduces voids, improves printability |
MR-NH | ROL0 | even appropriate for applications with an area ratio smaller than 0.6 |
NH(-MDL) 100% halide-free |
ROL0 | micro dispensing |
NH (IMT) 100% halide-free |
ROL0 | characteristics like L1 paste, still perfect after long open time |
INP | ROL1 | designed for indium based alloys |
GT-Serie | ROL1 | high preheat resistance, perfect print shape |
SUC-Serie | ROL1 | O2-reflow, low voiding |
PZV | ROL1 | perfect for low peak temperatures |
HF-A | ROL0 | laser applications |
MDA-5 | ROL1 | jet printing paste for MYDATA U |
MJD | ROL1 | jet printing paste for Musashi R5-20 |
SSI-M | ROM1 | laser application |
TM-HP (O) | ROM1 | long open time |
SBR | ROL1 | ideal for bismuth alloys |
Alloy | Composition | Melting range | Particular advantage |
LFM-65 | Sn-58.0Bi | 139°C | very low melting range, Sn-Bi eutectic |
LFM-89 | Sn-57.6Bi-0.4Ag | 139–168°C | very low melting bismuth alloys with increased strength |
LFM-78 | Sn-57.0Bi-1.0Ag | 139–179°C | very low melting bismuth alloys with increased strength |
LFM-31 | Sn-8.0Zn-3.0Bi | 190–203°C | also usable with temperature profile of Sn-Pb alloys |
LFM-70 | Sn-3.5Ag-0.5Bi-8.0In | 194– 206°C | low melting range, SABI |
LFM-96 | Sn-3.5Ag-0.5Bi-6.0In | 202–210°C | low melting range, SABI |
SJM-03 | Sn-0.3Ag-0.7Cu-2.0Bi-α | 210–225°C | low Ag, high solder joint strength |
LFM-90 | Sn-1.0Ag-0.7Cu | 217–224°C | JEITA recommended |
LFM-48 | Sn-3.0Ag-0.5Cu | 217–220°C | SAC, JEITA recommended |
LFM-86 | Sn-0.3Ag-0.7Cu | 217–228°C | low Ag, SAC |
LFM-34 | Sn-3.5Ag eutectic | 221°C | Sn-Ag |
SJM-40* | Sn-4.0Ag-2.0Bi-3.0Sb-α | 221–227°C | high Ag, very high solder joint strength |
LFM-57 | Sn-5.0Sb | 235–240°C | high melting range |
LFM-74 | Sn-10.0Sb | 246–258°C | high melting range, Sn-Sb |
Powder size: X, W, U, N
All our lead-free solder pastes are available with the following flux content: 11-14%
*SJM-40 is patented under: JP PAT Nr. 3045453
SJM = Strong Joint Metal
LFM = Leadfree Metal
Alloy | Flux classification | Laser & inductive soldering | Reflow soldering (SMT) |
LFM-48 (SAC 305) |
L0 | HF-A NH-MDL |
MR-NH |
L1 | SSI-M | GT-Series | |
M1 | - | TM-HP(O) | |
SJM-Series (Sn, Ag, Cu, Bi) |
L0 | - | NH(IMT) |
L1 | - | GT-Series | |
M1 | - | TM-HP(O) | |
LFM-96 | L1 | - | INP |
powder size | 10% max. less than | 80% min. between | 10% max. between | less than 0,5% larger than |
3 | 25 | 25 - 45 | 45 - 60 | 60 |
4 | 20 | 20 - 38 | 38 - 50 | 50 |
5 | 15 | 15 - 25 | 25 - 40 | 40 |
6 | 5 | 5 - 15 | 15 | 25 |
7 | 2 | 2 - 11 | 11 | 15 |
Almit name | X | W | U | N | R | G |
Crain size in μm | 25-45 | 20-38 | 10-28 | 10-24 | 5-20 | 5-15 |
Powder size | 3 | 4 | 5 | 5/6 | 5.5 | 6 |