Flux of lead-free solder pastes

    Flux Flux classification Particular advantage
    NH (LVA)
    100% halide-free
    ROL0 reduces voids, improves printability
    MR-NH ROL0 even appropriate for applications with an area ratio smaller than 0.6
    NH(-MDL)
    100% halide-free
    ROL0 micro dispensing
    NH (IMT)
    100% halide-free
    ROL0 characteristics like L1 paste, still perfect after long open time
    INP ROL1 designed for indium based alloys
    GT-Serie ROL1 high preheat resistance, perfect print shape
    SUC-Serie ROL1 O2-reflow, low voiding
    PZV ROL1 perfect for low peak temperatures
    HF-A ROL0 laser applications
    MDA-5 ROL1 jet printing paste for MYDATA U
    MJD ROL1 jet printing paste for Musashi R5-20
    SSI-M ROM1 laser application
    TM-HP (O) ROM1 long open time
    SBR ROL1 ideal for bismuth alloys

    Lead-free solder paste alloys at a glance

    Alloy Composition Melting range Particular advantage
    LFM-65 Sn-58.0Bi 139°C very low melting range, Sn-Bi eutectic
    LFM-89 Sn-57.6Bi-0.4Ag 139–168°C very low melting bismuth alloys with increased strength
    LFM-78 Sn-57.0Bi-1.0Ag 139–179°C very low melting bismuth alloys with increased strength
    LFM-31 Sn-8.0Zn-3.0Bi 190–203°C also usable with temperature profile of Sn-Pb alloys
    LFM-70 Sn-3.5Ag-0.5Bi-8.0In 194– 206°C low melting range, SABI
    LFM-96 Sn-3.5Ag-0.5Bi-6.0In 202–210°C low melting range, SABI
    SJM-03 Sn-0.3Ag-0.7Cu-2.0Bi-α 210–225°C low Ag, high solder joint strength
    LFM-90 Sn-1.0Ag-0.7Cu 217–224°C JEITA recommended
    LFM-48 Sn-3.0Ag-0.5Cu 217–220°C SAC, JEITA recommended
    LFM-86 Sn-0.3Ag-0.7Cu 217–228°C low Ag, SAC
    LFM-34 Sn-3.5Ag eutectic 221°C Sn-Ag
    SJM-40* Sn-4.0Ag-2.0Bi-3.0Sb-α 221–227°C high Ag, very high solder joint strength
    LFM-57 Sn-5.0Sb 235–240°C high melting range
    LFM-74 Sn-10.0Sb 246–258°C high melting range, Sn-Sb

    Powder size: X, W, U, N
    All our lead-free solder pastes are available with the following flux content: 11-14%
    *SJM-40 is patented under: JP PAT Nr. 3045453
    SJM = Strong Joint Metal
    LFM = Leadfree Metal

    Favored product combinations for Almit solder pastes

    Alloy Flux classification Laser & inductive soldering Reflow soldering (SMT)
    LFM-48
    (SAC 305)
    L0 HF-A
    NH-MDL
    MR-NH
    L1 SSI-M GT-Series
    M1 - TM-HP(O)
    SJM-Series
    (Sn, Ag, Cu, Bi)
    L0 - NH(IMT)
    L1 - GT-Series
    M1 - TM-HP(O)
    LFM-96 L1 - INP

    Crain size (µm) according to IPC

    powder size 10% max. less than 80% min. between 10% max. between less than 0,5% larger than
    3 25 25 - 45 45 - 60 60
    4 20 20 - 38 38 - 50 50
    5 15 15 - 25 25 - 40 40
    6 5 5 - 15 15 25
    7 2 2 - 11 11 15

    Almit powder sizes according to J-STD 005

    Almit name X W U N R G
    Crain size in μm 25-45 20-38 10-28 10-24 5-20 5-15
    Powder size 3 4 5 5/6 5.5 6
    Almit powder sizes according image