Soldering terminology

In general, it is an epoxy resin adhesive admixed in a volume ratio of 90% or more with copper or silver powder. It is used as solder replacement for mounting chips or LSI and it is essential for connecting a chip to an ITO electrode mounted on a glass or plastic substrate (by pressure) and for producing PCBs with low heat emission. The points at which the adhesive has been applied are referred to as bumps.